永利集团,永利皇宫会员注册登录

教育背景:

　　2000-2004：德国慕尼黑工业大学 电子工程 工学博士(Dr.-Ing.)

工作经历:

　　2004-2009: 英飞凌科技公司，德国中央研究部，器件专家

　　2009-2011：永利集团电子信息与电气工程学院，副教授

　　2011-至今：永利集团，副教授

　　2017-至今：永利皇宫会员注册登录院电子材料技术研究所，副所长

　　2019-至今：永利皇宫会员注册登录院先进信息材料联合研究中心，副主任

　　Book Silver Metal Organic Chemical Vapor Deposition for Microelectronic Metallization，2005，Shaker Verlag, ISBN 3-8322-3895-6 Journal Papers

　　L. Gao, C. Burmer: PLL soft functional failure analysis in advanced logic product using fault based analogue simulation and soft defect localization. Microelectronics Reliability 48 (2008) 1349-1353.

　　L. Gao, C. Burmer and F. Siegelin: ATPG scan logic failure analysis: a case study of logic ICs: fault isolation, defect mechanism identification and yield improvement. Microelectronics Reliability 46 (2006) 1458-1463.,

　　L. Gao, P. Haerter, Ch. Linsmeier, A. Wiltner, R. Emling and D. Schmitt-Landsiedel: Silver metal organic chemical vapor deposition for advanced silver metallization. Microelectronic Engineering 82 (2005) 296-300.

　　L. Gao, P. Haerter, Ch. Linsmeier, J. Gstoettner, R. Emling and D. Schmitt-Landsiedel: Metalorganic Chemical Vapor Deposition of Silver Thin Films for Future Interconnects by Direct Liquid Injection System. Materials Science in Semiconductor Processing, Vol. 7, 2004, 331-335 ,

　　L. Gao, J. Gstoettner, R. Emling, M. Balden, Ch. Linsmeier, A. Wiltner, W. Hansch, and D. Schmitt-Landsiedel: Thermal stability of titanium nitride diffusion barrier films for advanced silver interconnects. Microelectronic Engineering, 76 (2004) 76-81.