永利集团,永利皇宫会员注册登录

2000至2004 永利集团 本科毕业

2004至2010 永利集团 博士毕业

2007至2008 美国密西根大学材料科学与工程系 联合培养

2010至2013 日本早稻田大学应用化学系 博士后

2013至2014 永利集团 讲师

2014至今 永利集团 副教授

1. 表面微纳米阵列材料的电化学制备技术。

2. 三维叠层封装硅通孔（TSV）技术。

3. 新型锂离子电极材料的制备及性能研究。

4. 商业化电池性能劣化诊断评价技术。

Y Wu, T Hang*, J. Komadina, H Ling and M Li. High-adhesive superhydrophobic 3D nanostructured silver films applied as sensitive, long-lived, reproducible and recyclable SERS substrates. Nanoscale, 2014, 6, 9720.

X Qian, T Hang*, H Nara, T Yokoshima, M Li and T Osaka. Electrodeposited three-dimensional porous SieOeC/Ni thick film as high performance anode for lithium-ion batteries. J. Power Sources, 2014, 272, 794.

T Hang, D Mukoyama, H Nara, T Yokoshima, T Momma, M Li and T Osaka*. Electrochemical impedance analysis of electrodeposited Si-O-C composite thick film on Cu microcones-arrayed current collector for lithium ion battery anode. J. Power Sources, 2014, 256, 226.

Y Wu, T Hang*, Z Yu, L Xu and M Li. Lotus leaf-like dual-scale silver film applied as a superhydrophobic and self-cleaning substrate. Chem. Comm., 2014, 50, 8405.

J Sanetuntikul, T Hang* and S Shanmugam. Hollow nitrogen-doped carbon spheres as efficient and durable electrocatalysts for oxygen reduction. Chem. Comm., 2014, 50, 9473.

H Cao, T Hang*, H Ling, L Gao, and M Li. Linear Sweep Voltammetric Study on the Copper Electrodeposition of Though-Silicon-Vias. J. Electrochem. Soc., 2014, 161, D349.

 Y Wu, T Hang*, N Wang, Z Yu and M Li. Highly durable non-sticky silver film with a microball-nanosheet hierarchical structure prepared by chemical deposition substrates. Chem. Comm., 2013, 49, 10391.

T Hang, H Nara, T Yokoshima, T Momma and T Osaka*. Silicon composite thick film electrodeposited on a nickel micro-nanocones hierarchical structured current collector for lithium batteries. J. Power Sources, 2013, 222, 503.

T Hang, D Mukoyama, H Nara, N Takami, T Yokoshima, T Momma and T Osaka*. Electrochemical impedance spectroscopy analysis for lithium-ion battery using Li4Ti5O12 anode. J. Power Sources, 2013, 222, 442.

H Cao, T Hang*, H Ling and M Li, Behaviors of Chloride Ions in Methanesulfonic Acid Bath for Copper Electrodeposition of Through-Silicon-Via. J. Electrochem. Soc., 2013, 160, D146.