1. Dongshi Zhang, Liang-Chun Wu, Masashi Ueki, Yoshihiro Ito, Koji Sugioka, Femtosecond laser shockwave peening ablation in liquids for hierarchical micro/nanostructuring of brittle silicon and its biological application.International Journal of Extreme Manufacturing, 2020, 2, 045001. (Front cover)
2. Dongshi Zhang, Bikas Ranjan, Takuo Tanaka, Koji Sugioka, Underwater persistent bubble-assisted femtosecond laser ablation for hierarchical micro/nanostructuring. International Journal of Extreme Manufacturing, 2020, 2, 015001. (Front cover, highlight)
3.Dongshi Zhang, Bikas Ranjan, Takuo Tanaka, Koji Sugioka, Carbonized Hybrid Micro/Nanostructured Metasurfaces Produced by Femtosecond Laser Ablation in Organic Solvents for Biomimetic Antireflective Surfaces. ACS Applied Nano Materials, 2020, 2, 28-39. (ACS Editor’s choice)
4.Dongshi Zhang, Koji Sugioka, Hierarchical microstructures with high spatial frequency laser induced periodic surface structures possessing different orientations created by femtosecond laser ablation of silicon in liquids. Opto-Electronic Advances 2019, 2, 190002. (Front cover)
5.Dongshi Zhang, Chao Zhang, Jun Liu, Chen Qi, Xiaoguang Zhu, Changhao Liang, Carbon-Encapsulated Metal/Metal Carbide/Metal Oxide Core–Shell Nanostructures Generated by Laser Ablation of Metals in Organic Solvents. ACS Applied Nano Materials 2019, 2, 28-39.
6. Dongshi Zhang, Bilal Gökce, Stephan Barcikowski: Laser Synthesis and Processing of Colloids – Fundamentals and Applications. Chemical Reviews 2017, 117, 3990-4103. (Highly cited paper)
7.Dongshi Zhang, Jun Liu, Pengfei Li, Zhenfei Tian, Changhao Liang: Recent Advances in Surfactant‐Free, Surface Charged and Defect‐Rich Catalysts Developed by Laser Ablation and Processing in Liquids. ChemNanoMat 2017, 3, 512–533. (Front cover, ChemNanoMat Readers’ Choice 2019)
8.Dongshi Zhang, Bilal Gökce, Steffen Sommer, René Streubel, Stephan Barcikowski: Debris-Free Rear-Side Picosecond Laser Ablation of Thin Germanium Wafers in Water with Ethanol. Applied Surface Science 2016, 367, 222-230.